May 10, 2024  
2018-2019 University Catalog 
    
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2018-2019 University Catalog [ARCHIVED CATALOG]

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EGME 487 - Thermal Control of Electronic Packaging (3)

Fluid mechanics and heat transfer as related to the thermal control of electronic packages of varying sizes. Consider analysis of individual components, complete boards and complete systems. Liquid and gas cooling mediums.

Prerequisites: EGME 308 , EGME 407 .

400-level Undergraduate Course available for Graduate Credit


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